SloveniaTRUMPF, a German high-tech company, has developed a new industrial process called HiPIMS that enables the precise coating of complex glass substrates used in next-generation AI chips. This innovation addresses the challenge of creating millions of microscopic through-holes in glass and reliably coating them with conductive materials. The process uses a high-performance plasma technology that allows for more uniform coatings, improving manufacturing yields and enabling the economic production of advanced AI chip packaging. Piotr Lach, TRUMPF's Head of Next Technology Demands, highlights the importance of reliable coating for future AI processor development. The technology is designed to meet the demands of mass production by ensuring consistency and reducing errors in the fabrication of glass-based chip substrates.
Bias read (Center): The article presents TRUMPF's technological advancement in a neutral manner, focusing on technical specifications and industry implications without overtly favoring any political ideology. It emphasizes the scientific and engineering aspects of the HiPIMS process, providing balanced information on其对
